Copyright ? 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree?, the Cree logo and XLamp?
are registered
trademarks of Cree, Inc.
7
XLamp mL-B LEDs
notes
lumen maintenance Projections
Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED
lumen maintenance. For information on the specifc LM-80 data sets available for this LED, refer to the public LM-80
results document at www.cree.com/xlamp_app_notes/LM80_results.
please read the XLamp Long-Term Lumen maintenance application note at www.cree.com/xlamp_app_notes/lumen_
maintenance for more details on Cree’s lumen maintenance testing and forecasting. please read the XLamp Thermal
management application note at www.cree.com/xlamp_app_notes/thermal_management for details on how thermal
design, ambient temperature, and drive current affect the LeD junction temperature.
moisture sensitivity
XLamp mL-B LeDs are shipped in sealed, moisture-barrier
bags (MBB) designed for long shelf life. If XLamp ML-B LEDs
are exposed to moist environments after opening the mBB
packaging but before soldering, damage to the LeD may occur
during the soldering operation. The derating table at right
defnes the maximum exposure time (in days) for an XLamp
ML-B LED in the listed humidity and temperature conditions. LEDs with exposure time longer than the time specifed
below must be baked according to the baking conditions listed below.
Cree recommends keeping XLamp LeDs in their sealed moisture-barrier packaging until immediately prior to use. Cree
also recommends returning any unused LeDs to the resealable moisture-barrier bag and closing the bag immediately
after use.
Baking conditions
It is not necessary to bake all XLamp mL-B LeDs. only the LeDs that meet all of the following criteria must be baked:
1.
LeDs that have been removed from the original mBB packaging.
2.
LeDs that have been exposed to a humid environment longer than listed in the moisture Sensitivity section above.
3.
LeDs that have not been soldered.
LeDs should be baked at 70
oC for 24 hours. LeDs may be baked on the original reels. Remove LeDs from mBB packaging
before baking. Do not bake parts at temperatures higher than 70
oC. This baking operation resets the exposure time as
defned in the Moisture Sensitivity section above.
temp.
maximum Percent relative humidity
30%
40%
50%
60%
70%
80%
90%
35 oC
-
-
-
17
1
.5
.5
30 oC
-
-
-
28
1
1
1
25 oC
-
-
-
-
2
1
1
20 oC
-
-
-
-
2
1
1
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相关PDF资料
MLEAWT-A1-0000-0005E3
LED XLAMP MLE WHITE SMD
MLEBLU-A1-0000-000T01
LED HIGH BRIGHTNESS
MMBD1203
DIODE FAST DUAL 100V SOT-23
MMBD1205
DIODE ULT FAST 100V 200MA SOT-23
MMBD1404
DIODE ULTRA FAST 200V SOT-23
MMBD1504A
DIODE SS 200V 200MA SOT23
MMBD2004SW-7-F
DIODE SS SW 250MW 240V SOT23-3
MMBD2004S
DIODE SWITCH 240V 350MW SOT23-3
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